PCB

At ABC Assembly, we continually optimize our manufacturing environment to take full advantage of the latest printed circuit board assembly and test equipment available. Our equipment and automated processes are designed to produce a highly flexible and repeatable manufacturing environment that meets the changing needs of our customers.

ABC Assembly's specialty is in mid-to-low volume, high-to-medium mix electronic printed circuit board assemblies of SMT, through-hole, and mixed technologies. We take pride in our work and put huge emphasis in the quality of our products by providing a robust first article inspection process (FAI), automated optical inspection procedures for production runs, as well as X-raying BGA and micro BGA placements.

Our Printed Circuit Board Capabilities include: Double sided PCB assembly, Surface mount (including micro BGA), Through-hole and mixed technology, High temperature (up to 350 C), Lead free (RoHs), Proto-types (fast turn-around), Conformal coating, Functional testing, and New Product Introduction (NPI).

We excel in high mix and low to medium volume runs as well as prototyping.

SMT, TH or Mixed PCB assemblies.

BGA's, micro BGA's and up to 01 005 placements.

Soldering standards to J-STD-001 and IPC Class II & II.